Specialized lapping and polishing services for 2–4" CVD diamond wafers: reach 100 nm Ra post-lapping and ultra-smooth <10 nm Ra , with TTV +- 20 µm — optimized for thermal management, optics, and high-reliability bonding surfaces.
Note: If you are interested in purchasing our ML-4 and MP-2 equipment, service charge will be applied as credit for equipment.
Specialized lapping and polishing services for 2–4" CVD diamond wafers: reach 100 nm Ra post-lapping and ultra-smooth <10 nm Ra , with TTV +- 20 µm — optimized for thermal management, optics, and high-reliability bonding surfaces.
Note: If you are interested in purchasing our ML-4 and MP-2 equipment, service charge will be applied as credit for equipment.
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